High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment

2025-04-13 introduction 2780

After-sales Service:

Provided

Condition:

New

Speed:

High Speed

Precision:

High Precision

Certification:

ISO

Warranty:

12 Months

Automatic Grade:

Automatic

Product Name:

Semiconductor Equipment

Feature 1:

Guaranteed Quality

Feature 2:

Customized According to Needs

After-Sale Service:

Provided

Trademark:

Himalaya

Transport Package:

Customized or Wooden Box Packaging

Specification:

Standard Specifications

Origin:

China

Like 0

Oppose 0

Awards 0

Comment 0