Share
Video
Categories
Channel
Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine / Die Attach
2025-04-13
introduction
322
0
After-sales Service:
Provide
Condition:
New
Certification:
ISO
Warranty:
12 Months
Automatic Grade:
Automatic
Installation:
Vertical
Driven Type:
Electric
Product Name:
Semiconductor Equipment
Feature 1:
Guaranteed Quality
Feature 2:
Customized According to Needs
After-Sale Service:
Provided
Trademark:
Himalaya
Transport Package:
Customized or Wooden Box Packaging
Specification:
Standard Specifications
Origin:
China
Like
0
Oppose
0
Awards
0
Comment
0
Share
0
High End Manufacturing Laser Sealing Machine
0Comment
462 Play
High End Laser Dicing Processing Ceramic Equipment
0Comment
313 Play
Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
0Comment
387 Play
High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
0Comment
278 Play