Share Video Categories Channel

Semiconductor Automatic Chip Laying Machine for Semiconductor IC Packaging Production

2025-04-13 2290

Condition:

New

Warranty:

12 Months

Automatic Grade:

Automatic

Installation:

Vertical

Driven Type:

Electric

Product Name:

Automatic Film Arrangement Machine

Feature 1:

Guaranteed Quality

Feature 2:

Customized According to Needs

OEM/ODM Service:

Provided

Trademark:

Himalaya

Transport Package:

Customized or Wooden Box Packaging

Specification:

Standard Specifications

Origin:

China

Like 0

Dislike 0

Comment 0

Dual Dispensing System Fully Automatic Submicron Placement Accuracy Eutectic Die Bonding Machine
0 Reviews397 Play

High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment
0 Reviews290 Play

Fully Automatic Semiconductor Glue Coating and Developing Equipment
0 Reviews378 Play

High Precision Automatic Wafer Eclectic Bonder Die Bonder Bonding Machine
0 Reviews239 Play

Home > Video > Manufacturing & Processing Machinery > Manufacturing Equipment for Electrical & Electronic Product > Other Manufacturing Equipments for Electrical & Electronic Product