Automatic IC Molding System Machine - Other Semiconductors - Semiconductor - Electrical & Electronics - Video

Application:

Detector, Diode, LCD Display Controller, Power Electronic Components, Radio, Refrigerator, Solar Cell, Television, Temperature Measurement

Certification:

CE

Manufacturing Technology:

Analog IC

Material:

Compound Semiconductor

Model:

LM317

Clamping Pressure:

98-1764kN

Injection Pressure:

4.9-29.4kN

Applicable Lead Frame/Substrate Size:

Width 20-90mm, Length 124-300mm, Thickness 0.15-1.

Applicable EMC Specifications: Diameter:

&Fcy; 11-&Fcy;20mm (±0.2mm)

Control System:

PLC (Omron)+ Host Computer

Operating System:

Win10+15-Inch Touch Screen + Touch Keyboard

Detection System:

CCD Image Detection, Feed Anti-Reverse Detection

Loader:

Aluminum Magazine

Unloader:

Auto Stack Load to Box Receiving

Optional:

Mold Vacuum System, Separator Film System

Trademark:

tjin

Transport Package:

Box

Origin:

China