Trim Form Singulation System Machine - Other Semiconductors - Semiconductor - Electrical & Electronics - Video

Batch Number:

2010+

Certification:

CE

Manufacturing Technology:

Optoelectronic Semiconductor

Material:

Power Semiconductor

Model:

LM317

Package:

BGA

Equipment Function:

After Molding, The Product Is Cut and Bent to Form

Applicable Package:

Sop/Ssop/Tsop/to/DLP and Other Series

Punching Power:

Servo Motor Upper Power -3~5t

Punching Speed:

50-100 Strokes/Min (Spm:50-100)

Control System:

PLC (Omron)

Operating System:

Touch Screen + Button, Display Uph/Spm Punching C

Loading Structure:

Rotary Double Magazine Loading

Receiving Mechanism:

Material Tube Collection (Tube Packing)

Safety Protection System:

The Equipment Has Leakage Protection Device, Emerg

Option 1:

CCD Visual Detection Device

Option 2:

Mes System Networking Function

Trademark:

Tjin

Transport Package:

Box

Origin:

China