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Alumina / Aluminum Nitride / Silicon Nitride Directed Plated Copper Dpc Substrate
2025-04-13
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Model NO.:
INC-DBC20310
Application:
Aerospace, Electronics, Medical, Vacuum Brazing
Compressive Strength:
2300MPa
Coating Thickness:
8-30μm
Coating Layer:
Mo/Mn
Plated Layer:
Nickel/Copper/Gold
Thermal Conductivity:
25W/(M.K)
Plating Thickness:
2-9μm
Max. Use Temperature:
1600ºC
Density:
3.7g/cm3
Type:
Insulating Ceramics
Trademark:
INNOVACERA
Transport Package:
Carton Packing
Specification:
Customized
Origin:
Fujian, China
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