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High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board图1High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board图2High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board图3High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board图4High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board图5High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board图6

High Precision Automatic Dicing Saw Machine for Silicon Wafers, GaAs, GaN, Glass, Sic, PCB Board

Price $500000.00
Min Order 1 Set  
Shipping from Jiangsu, China
Quantity
-+
Product details
High Temperature Resistance
Automatic
New
ISO
12 Months
Automatic
Desktop
Electric
>1,000,000 Shots
Semiconductor Wafer Saw Machine
Guaranteed Quality
Customized According to Needs
Provided
Himalaya
Customized or Wooden Box Packaging
Standard Specifications
China
Product Description
Product Description

It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc.

X axismaximum effective
input rang of feed speed
310mm
0.1-1000mm/s
310mm210mm
0.1-1000mm/s0.1-600mm/s
Y axismax effective310mm310mm170mm
single step increment0.0001mm0.0001mm0.0001mm
reach accuracy0.003mm/310mm0.003mm/310mm0.003mm/170mm
Z axismaximum effective40mm40mm40mm
repetition accuracy0.001mm0.001mm0.001mm
maximum cutter diameter585858
T axismaximum rotation angle380°380°380°
spindlespeed range6000-60000rpm6000-60000rpm6000-60000rpm
output power1.8KW(2.4KW)1.8KW(2.4KW)1.5KW (2.4KW)
powerAC380V±10%AC380V±10%AC380V±10%
Size W×D×H1200mm×1629mm×1849mm1080mm×1160mm×1800mm630mmx900mmx1600mm

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.

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Jiangsu Himalaya Semiconductor Co., Ltd.

Audited Supplier2 Years
ProfileCertified by SGS/BV

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