Epoxy resin 3136AB-SM11 is an epoxy resin glue cured at room temperature and low temperature. It has strong adhesion, good yellowing resistance, very good surface effect, natural defoaming, greenhouse curing or heating curing; it is specially used for covering large areas. Marble surface coating, resin painting surface coating, removal, background wall surface coating, and other nameplates, electronic potting and bonding, mold perfusion, and insulation, moisture-proof potting, confidentiality sealing, coating protection, etc. of other electronic parts.
it is dedicated to the insulation of large pieces of crafts, river table and electronic potting and mold filling and other electronic parts, moisture-proof potting, secret sealing and so on.
Metallic Resin Floor
Resin Industrial Floor
Resin 3D Floor Resin Flake Floor
Color: Colorless and transparent
Proportion : 1.15 0.97
Viscosity 25ºC: 1000-1800CPS 250MAXCPS
Conditions of Use
1)Ratio: A :B=100 :33 (Weight ratio)
2) Hardening conditions: 25ºC×8H-10H initial curing, 24 hours complete curing; 50ºC×2H (2g)
3)Pot life: 25ºC×30min (100g)
1) Hardness: Shore D <83
2) Withstand voltage: KV/mm 22
3) Bending strength: Kg/mm2 28
4) Volumeresistance: Ohm3 1x10*15
5) Surfaceresistance: Ohmm2 5X10*15
6) Thermal conductivity : W/M.K 1.36
7 ) Lure power loss : 1KHZ 0.42
8 ) Heat distortion temperature : ºC 80
9 ) Water absorption : % <0.15
10) Compressive strength : Kg/mm2 8.4
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