Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
2025-04-13
introduction 4090
GS, RoHS, CE, ISO9001
Normal Temperature
Wafer Dicing
Wafer UV Dicing Tape
UV Release Dicing Tape
Easy Peeling No Residue
280~380 G/in
< 10 G/in
Carton
customizable