Name: Video for Wafer UV Dicing UV Release Dicing Tape 140micron Matte Translucent with Acrylic Adhesive for Wafer Back Grinding Tape Semiconductor Polishing
Uploaded: 2025-03-12T15:23:55+08:00

Model NO.:

MG-6410B-AU

Certification:

GS, RoHS, CE, ISO9001

Color:

Transparent

Heat Resistance:

Normal Temperature

Waterproof:

Waterproof

Application:

Wafer Dicing

Adhesive:

Acrylic

Base Material:

Po Film

Type:

Wafer UV Dicing Tape

Product Name:

UV Release Dicing Tape

Liner:

Pet Release Liner

Feature:

Easy Peeling No Residue

Adhesion Before UV:

280~380 G/in

Adhesion After UV Irradiation:

< 10 G/in

Customization:

Available

Trademark:

Migui

Transport Package:

Carton

Specification:

customizable

Origin:

Dongguan