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Underfill Glue Sealant Acrylate Epoxy Resin Adhesive for Semiconductor Application

2025-04-13 introduction 2740

Model NO.:

5214BK

Bonding Function:

Structural Adhesive

Morphology:

Solvent

Application:

Automobile, Construction, Woodworking, Electronic Product

Material:

Acrylic

Classification:

Thermosetting

Main Agent Composition:

Natural Polymer

Characteristic:

Weatherability

Promoter Composition:

Tackifier

Composition:

Inorganic Material

Color:

Clear

Product Name:

Adhesive Glue

Keyword:

Acrylate Adhesive

Viscidity:

Customization

Chemical Composition:

Epoxy

Curing Condition:

80 Degrees 15min

Shelf Life and Temperature:

3 Months < -28 Degrees

Product Features:

LCM Step Protection

Typical Application:

Semiconductor Application

Bonding Strength:

Strong

Materials:

Acrylate

Trademark:

radhow

Transport Package:

Carton

Specification:

customization

Origin:

China

HS Code:

3505200000

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