Transverse Wafer Grinder Thinning Polishing - Grinding Machine - Machine Tools - Manufacturing & Processing Machinery - Video

Model NO.:

FD-300

After-sales Service:

12months

Warranty:

12months

Type:

Surface Grinding Machine

Processing Object:

Flat Workpieces

Abrasives:

Grinding Wheel

Controlling Mode:

PLC

Automatic Grade:

Semiautomatic

Cylindrical Grinder Type:

Surface Grinding Machine

Precision:

High Precision

Certification:

ISO 9001

Condition:

New

Power Source:

Electricity

Disc(Wheel) Type:

Grinding Disc

Variable Speed:

with Variable Speed

Type:

Thinning Equipment

Application:

Grinding Industry

Working Style:

Thinning

Service:

Oversea Setup & After-Sale Avalaible

Class:

Thinner

Process Station:

1

Abrasive:

Recyclable Water & Grinding Wheel

Wheel Rotate Speed:

0-3000 Rpm

Workpiece Accuracy Control(Parallelism):

1um

Power of Grinding Wheel Motor:

5.5kw

Trademark:

PONDA

Transport Package:

Wood Crate

Origin:

China