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Solder Paste Material for IC PCB BGA Cellphone Repairing

2026-06-28 3310

Model NO.:

305

Melting Point:

217ºC

Component:

Sn96.5AG3cu0.5

Tin Powder Particles:

T3/T4

Application:

SMT

Weight:

500g

Cleaning Angle:

No Cleaning

Trademark:

YOSHIDA

Transport Package:

Carton+Foam Box

Specification:

500g

Origin:

China

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