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Solder Paste Material for IC PCB BGA Cellphone Repairing
2025-04-13
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306
0
Model NO.:
305
Melting Point:
217ºC
Component:
Sn96.5AG3cu0.5
Tin Powder Particles:
T3/T4
Application:
SMT
Weight:
500g
Cleaning Angle:
No Cleaning
Trademark:
YOSHIDA
Transport Package:
Carton+Foam Box
Specification:
500g
Origin:
China
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