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Sn96.5 AG3.0 Cu0.5 No-Clean Lead-Free Halogen-Free Solder Paste for Electronics
2025-04-13
introduction
439
0
Model NO.:
MC-228-1
state:
Paste
Type:
Solder Paste
Melting Point:
217-221
Chemical Composition:
Sn AG3.0 Cu0.5
Function:
Printing Application
Selling Units:
Single Item
Single Gross Weight:
0.500 Kg
Storage Condition:
2-10c
Powder Size:
T3:25-45um T4:20-38um T5:15-25um
Appearance:
Silver Paste
Weight:
500g
Customize Support:
OEM,ODM
Viscosity:
18030PA S or Customized
Product Name:
Solder Paste
Product Name2:
Lead-Free Halogen-Free Solder Paste
Single Package Size:
10X5X5cm
Trademark:
APS
Specification:
500g
Origin:
Fujian, China
HS Code:
8311200000
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