Se685 Black Good Thermal Conductivity 2K Epoxy Potting Adhesive for Automotive Electronic Module - Adhesive - Chemicals - Video

Model NO.:

SE685

CAS No.:

9009-54-5

Formula:

CH3h8n2o

EINECS:

210-898-8

Bonding Function:

Structural Adhesive

Application:

Automobile, Construction

Material:

Epoxy

Color:

Black

Type:

Two-Component

Main Raw Material:

Epoxy Adhesive

Advantage:

High Bond Strength and Sealing

Usage:

Transformer, Electronic Stator, Ignition Coil, etc

OEM/ODM:

Free OEM&ODM Service

Shelf Life:

9 Months

Hardness:

Shore D 85

Flame Retardant Grade:

UL94 V-0

Dielectric Strength:

More Than 17 Kv Per mm

Thermal Conductivity:

1.0

Applications:

Motor, Automotive Electronics, Power Tools

Trademark:

SEPNA

Transport Package:

Air, Sea, Road and Railway.

Specification:

25KG per bucket

Origin:

China

HS Code:

35069900