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Quality Supplier 2in 4in 6in 8in Semiconductors Polishing Silicon Wafer
2025-04-13
introduction
340
0
Growth Method:
CZ and Fz
Orientation:
111 or 100
Resistivity:
0.0005 to 150
Surface:
Double Side Polished or Single Side Polished
Dopant:
N Type and P Type
Particles:
<30 at 0.3um
Bow:
< 30 Um
Ttv:
<15 Um
Manufacturing Technology:
Optoelectronic Semiconductor
Material:
Compound Semiconductor
Type:
Intrinsic Semiconductor
Package:
SMD
Signal Processing:
Analog Digital Composite and Function
Application:
LED
Transport Package:
Box
Origin:
Jiaozuo Henan
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