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Qfn Chipset Lead Frame Packaging Tape Made of Durable Pi Material
2025-04-13
introduction 4360
2560
Chips
Golden
Adhesive
Polyimide
<10KV
250 250
Any±0.5 M
Any±0.3 mm
0.03±0.002 mm
Film Surface Smooth, No Obvious Defects and Debris
Insulation Tape
Organic Insulation
Organic Insulating Material
ISO9001
Lvmei
LVMEI
Carton Package
Polyimide+silicone
Guangdong
3920920000
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