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Printed Circuit Board Assembly for Renewable Energy with High Efficiency PCB

2025-04-13 introduction 4970

Type:

Rigid Circuit Board

Dielectric:

FR-4

Material:

Fiberglass Epoxy

Flame Retardant Properties:

V0

Mechanical Rigid:

Rigid

Processing Technology:

OSP

Base Material:

Fr4

Insulation Materials:

Epoxy Resin

Model:

PCB

Copper Thickness:

3oz -105oz

Surface Finish:

Gold Finger

Special Teck:

Metal Edging

Special 1:

Blind Hole

Special 2:

Buried Vias

Special 3:

Flex-Rigid PCB

Trademark:

hemeixin

Transport Package:

Box

Origin:

China

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