Premium Diamond Grinding Wheel for PCB Micro Drilling Applications

2025-04-13 introduction 3050

Model NO.:

XINRUI-G1

Material:

Diamond

Abrasive:

Superabrasive

Grain Size:

20#-1000#

Cylindricity:

<0.02

Circular Degree:

<0.01

Technics:

Electroplating

Working Style:

Surface Grinding

Grinding Types:

Grooving, Step Grinding, Cylindrical Grinding, End

Binder:

Ceramic Binder, Resin Bin

Grinding Wheel Shape:

1A1, 3A1, 14A1, 1V1, 11V9, 12V9, 4

Abrasive Type:

Diamond, CBN

Supporting Grinder:

Makino CNC Grinder

Trademark:

XINRUI

Transport Package:

Carton

Origin:

Henan China

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