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Pes Hot Melt Adhesive Film for IC Card in The Electronics Industry
2025-04-13
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Model NO.:
WT-51
Bonding Function:
Hot Melt Adhesive
Morphology:
Film
Application:
Woodworking, Footwear & Leather, Fiber & Garment
Material:
Polyurethane
Classification:
Hot Melt
Main Agent Composition:
Thermoplastic Resin
Characteristic:
Good Viscosity
Promoter Composition:
Tackifier
Composition:
Inorganic Material
Color:
Clear
Washable:
30 to 90 Temperature
Tensile Strength:
High, More Than 30
Shelf Life:
One Year
Certificate:
ISO 9001
Glue Type:
Hot Melt
Bonding Method:
Thermal Bonding
Samples Policy:
Free
Model:
Wt-P86
Softening Point:
122 Temperature
Transport Package:
100sqm/Roll
Specification:
0.01-0.03mm thickness
Origin:
Jiangyin, China
HS Code:
3506919090
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