Pcf8574ap New Original Integrated Circuit IC Chips - N-type Semiconductor - Semiconductor - Electrical & Electronics - Video

Model NO.:

PCF8574AP

Structure:

Multilayer Rigid PCB

Dielectric:

Fr-4

Flame Retardant Properties:

V0

Processing Technology:

Electrolytic Foil

Production Process:

Semi-Additive Process

Base Material:

Copper

Insulation Materials:

Metal Composite Materials

Board Thickness:

2mm

Copper Thickness:

1oz

Test:

Flying Probe & Fixture

Solder Mask Type:

Green

Min.Line Width/Space:

4/4mil

Min. Finished Hole Size:

4mm

Certification:

RoHS, CCC, ISO, EPA

Customized:

Customized

Manufacturing Technology:

Optoelectronic Semiconductor

Material:

Element Semiconductor

Type:

N-type Semiconductor

Package:

DIP(Dual In-line Package)

Signal Processing:

Simulation

Application:

Solar Cell

Batch Number:

2023

Trademark:

Rogers

Transport Package:

Bubble Pack+Aluminum Foil Pack

Specification:

580*620

Origin:

China

HS Code:

8534009000