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PUR Glue Hot Melt Glue Adhesive Uch2055 for Mdp MDF Lamination
2025-04-13
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Model NO.:
PUR
CAS No.:
112926-00-8
Formula:
-Nhcoo-
EINECS:
112926-00-8
Bonding Function:
High Temperature Resistant Adhesive
Morphology:
Solid-State
Application:
Lamination
Material:
PUR
Classification:
Hot Melt
Main Agent Composition:
PUR
Characteristic:
Weatherability
Promoter Composition:
Single Component
Composition:
Organic Material
Color:
White
Trademark:
UCH2055
Transport Package:
200kg Drum
Specification:
Solid
Origin:
China
HS Code:
35069190
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