Combining Rigid Circuit Board
V1
Metal Composite Materials
Delay Pressure Foil
Medical Instruments
Paper Phenolic Copper Foil Substrate
Retangular, Round, Slots, Cutouts, Complex, Irreg
OSP, Immersion Gold, Immersion Tin, Immersion AG
Turnkey Assembly PCB Service
Repair/Rework Services Mechanical Assembly Box Bui
QA Inspection and Ect.
ISO9001, ISO14000, Ts16949.UL.RoHS
-40c~125c
Green;Red;Yellow;Black;White and Ect.
HASL, Gold Finger, OSP, Enig, Peelable Mask
Inner Vacuum Packing and Outer by Cartons
FR4, 1.6mm, multiLayer, 1OZ Copper Thickness
Guangdong Shenzhen, China