Low Pressure Overmolding Bostik Thermelt Technomelt Hot Melt Glue

2025-04-13 introduction 2940

Model NO.:

HM003

Bonding Function:

Instant Adhesive

Morphology:

Solid-State

Application:

Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing, Labels\Waterproof Fields

Material:

Epoxy

Classification:

Hot Melt

Main Agent Composition:

Thermoplastic Resin

Characteristic:

Strong Adhesion

Promoter Composition:

Antioxidant

Color:

Clear

Trademark:

OEM

Specification:

1kg Meltable film packaging

Origin:

China

HS Code:

35069190

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