Liquid Silicone PU Epoxy Rubber Electronic Potting for Board Encapsulation Moulding Potting Sealant

Name: Video for Liquid Silicone PU Epoxy Rubber Electronic Potting for Board Encapsulation Moulding Potting Sealant
Uploaded: 2025-03-12T15:23:55+08:00

2025-04-13 2830

Model NO.:

SP295

CAS No.:

9009-54-5

Formula:

CH3h8n2o

EINECS:

210-898-8

Bonding Function:

Potting Sealing

Morphology:

Liquid

Application:

Automobile, Construction, Woodworking

Material:

Polyurethane

Classification:

Room Curing

Main Agent Composition:

Polyurethane

Characteristic:

Weatherability

Promoter Composition:

Curing Agent

Composition:

Polyurethane

Color:

Black

Trademark:

SEPNA

Transport Package:

25kg/Pail

Specification:

A: B=100: 15

Origin:

China

HS Code:

3506100090

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