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High Speed Motherboards for Servers with Advanced Processing Power Circuit-Board
2025-04-13
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Metal Coating:
Copper
Mode of Production:
DIP
Layers:
Multilayer
Base Material:
FR-4
Certification:
RoHS, ISO
Customized:
Customized
Condition:
New
Type:
Rigid Circuit Board
Dielectric:
Fr-4
Material:
Fiberglass Epoxy
Application:
Consumer Electronics
Flame Retardant Properties:
V0
Mechanical Rigid:
Rigid
Insulation Materials:
Epoxy Resin
Processing Technology:
Immersion Gold
Copper Thickness:
3oz -105oz
Surface Finish:
Gold Finger
Special Technology:
Metal Edging
Special 1:
Blind Hole
Special 2:
Buried Vias
Special 3:
Flex-Rigid PCB
Surface Finish 1:
Immersion Gold Immersion Tin Hal Lead Free
Trademark:
hemeixin
Transport Package:
Box
Origin:
China
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