High Precision Eutectic Wafer Bonder Chip Bonding Equipment with Die Attach System Eutectic Crystal Planting Machine

2025-04-13 introduction 2300

Model NO.:

MDZW-TP2032

After-sales Service:

1 Year

Condition:

New

Speed:

Super High Speed

Precision:

High Precision

Certification:

Warranty:

12 Months

Automatic Grade:

Automatic

Type:

High-speed Chip Mounter

Weight:

800

Power Supply:

AC220V Earth 10%, 50-60Hz, 10A

Compressed Air:

>=0.2MPa, Flow Rate>5lpm,

Thickness:

50um-17mm

Trademark:

minder-hightech

Transport Package:

840 * 1220 * 2000mm

Specification:

840 * 1220 * 2000mm

Origin:

China

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