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High Lead Sn10pb90 Solder Ball BGA Planting Ball High Temperature

2025-04-13 introduction 3750

Model NO.:

Sn10

Packing:

250K

Melting Point:

287°c

Application:

Chip/BGA Soldering

Composition:

Sn10pb90

Trademark:

YOSHDIA

Transport Package:

Carton+Foam Box

Specification:

0.2-. 88mm

Origin:

China

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