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High-Density Interconnect Rigid-Flex PCB Board for Ai Applications

2025-04-13 3550

Model NO.:

multi-layer PCB

Type:

Rigid Circuit Board

Flame Retardant Properties:

V0

Dielectric:

CEM-1

Base Material:

Copper

Insulation Materials:

Epoxy Resin

Processing Technology:

Electrolytic Foil

Application:

Consumer Electronics

Mechanical Rigid:

Rigid

Material:

Paper Phenolic Copper Foil Substrate

Brand:

Hemeil

Trademark:

hemeil

Transport Package:

Vacuum-Packed

Specification:

20*20

Origin:

Dongguan

HS Code:

8534009000

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