Name: Video for Electronic Direct Bond Copper Aln Plate Insulator Aluminum Nitride Ceramic Substrate
Uploaded: 2025-03-12T15:23:55+08:00

Model NO.:

BBTAN001

Application:

Electronics

Type:

Ceramic Plate

Application:

Electronics, Refractory, Industrial Ceramic

Type:

Ceramic Plate

Function:

Wear Resistant

Process:

Porcelain Ceramic Plate

Material:

Aluminum Nitride

Color:

Ivory

Density:

3.3 g/cm3

Size:

Customized

Thermal Conductivity(30°c, W/M.K):

>170

Flexural Strength (MPa):

382.7

Keyword:

Copper Coated

Dielectric Strength (Kv/mm):

18.45

MOQ:

2 PCS

Keywords 1:

Aluminum Nitride Substrate

Keywords 2:

Copper Plating Substrate

Trademark:

BB

Transport Package:

Packaged by Polybay and Bubble Bag in The Stardard

Specification:

OEM

Origin:

China