Direct Bond Copper Dbc Metallization High Performance Aln Aluminium Nitride Substrate

Name: Video for Direct Bond Copper Dbc Metallization High Performance Aln Aluminium Nitride Substrate
Uploaded: 2025-03-12T15:23:55+08:00

2025-04-13 2810

Model NO.:

Customized

Application:

Laser Diode (Ld)

Finished Product:

Ceramic Circuit Board

Substrate Material:

Aluminium Nitride (Aln) Ceramic

Surface Metallization Process:

Direct Bond Copper (Dbc / Dcb)

Feature:

Strong Bonding Strength Between Ceramic and Metal

Trademark:

JingHui

Transport Package:

Vacuum Packaging

Specification:

According to the Drawing

Origin:

China

HS Code:

8547100000

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