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Copper Clad Laminates for PCB, Xpc/Fr1/Fr2

2026-07-17 4330

Model NO.:

XPC

Structure:

Double-Sided Rigid PCB

Dielectric:

FR-2

Material:

Phenolic Paper Laminate

Application:

Consumer Electronics

Flame Retardant Properties:

V0

Processing Technology:

Electrolytic Foil

Production Process:

Additive Process

Base Material:

Phenolic Paper

Insulation Materials:

Organic Resin

Brand:

Hjh

Trademark:

HJH

Transport Package:

Pallet

Specification:

1030*1230MM

Origin:

China

HS Code:

7410211000

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