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Besi Datacon 8800 FC Quantum Advanced Die Bonding Machine
2025-04-13
introduction 3220
Datacon 8800 FC QUANTUM advanced
24 Hrs Online
Used
High Speed
High Precision
RoHS, ISO, CE
6 Months
Automatic
Die Bonding Machine
Used
Datacon 8800 FC Quantum Advanced
Tested
Besi Die Bond Machine
Die Bond Machine
Chip Industry
2000 PCS
Good
BESI
Carton Packing or Wooden Case
One piece per package
USA
8479909090
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