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Back Grinding Wheels for Semiconductor Wafers Process
2025-04-13
introduction 3700
Silicon wafer wheel
Thinning
Diamond Abrasive
Silicon Wafer Back
Polishing
80#---1000#
Cylindrical
1 Years
7 Days/24 Hours
Long Life
Cubic Boron Carbide
OEM, ODM
Vitrified & Resin
Diamond Grinding Wheel
Wooden Box
Angle Grinding Wheels
Vitrified & Resin
Steel or Aluminium
HT
Wooden Boxes
JB
Henan, China
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