99.7% Alumina Wafer Polishing Plate for Chemical Mechanical Polishing

2025-04-13 introduction 3400

Model NO.:

Alumina Ceramic Wafer Polishing Plate

Type:

Disc Grinder

Power Source:

Chemical Mechanical Polishing

Object:

Wafer

Application:

Semiconductor

Disc(Wheel) Type:

Polishing Plate

Material:

Alumina Ceramics

Working Style:

Chemical Mechanical Polishing

Disc Diameter:

Within 850mm

Trademark:

Chemshun Ceramics

Transport Package:

Carton and Wooden Box

Specification:

size below &varnothing; 850mm, thickness 45mm.

Origin:

China

HS Code:

6909191200

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