Chip packaging technology has undergone several generations of changes, from TO, DIP, SOP, QFP, BGA to CSP and then MCM. The packaging form has changed from traditional single-chip packaging to multi-chip packaging. The change in packaging form has led to the continuous improvement of packaging mold application technology. The traditional single-injection head packaging mold can no longer meet the packaging requirements. The mold structure has developed from single-cylinder mold → multi-injection head packaging mold (MGP) → integrated circuit automatic packaging system.
Main packaging forms
TO series: T0220/263/247/252/3P, etc.;
SOP series: SOP4/6/8/1 0/12/14/16/20/28, etc.;
DIP series: DIP4/8/14/16/18/23/24/25/29/40, etc.;
SOT series: SOT23/25/26/223/89, etc.;
SOD series: S0D123/323/523/723/923, etc.;
QFN/BGAPDFNOFP/SMA/MBF/TSSOP series, etc.;
QFP/IPM series, etc.;
