1. Adjustable - use electric amplitude modulation for the conveying mechanism, and the width can be adjusted arbitrarily;
2. Inline conveying system - used for communicating with front and rear equipment;
3. Aluminum alloy - the vacuum chamber;
4. Ultra low temperature - the temperature is as low as 40 ºC;
5. Omnidirectional surface cleaning - different plasma can enter the ultra-fine slit for cleaning;
6. Environmental protection - no harmful substances are produced before and after treatment, and keep away from the harmful solvents to human body;
7. Stability - continuity and constancy to maintain the stability of machinery and equipment during operation;
8. Cleaning - remove dust and oil, fine cleaning and static electricity;
9. Excitation - improve the adhesion ability of the surface and greatly increase the surface energy of the object;
10. Platy stripping - AF / AS layer platy stripping.
| Function configuration | Technical parameter | |
| Model | VP-10L | VP-10P |
| Dimensions(mm) | L=1600,W=1010,H=1750 | L=1600,W=1010,H=1750 |
| Weight(kg) | 540 | |
| Control | Programmable controller(PLC) | |
Time to achieve vacuum time (s) | 15 | |
Applicable dimension of product (mm) | Width ≤ 350, length ≤ 370, height ≤ 18 | |
| Conveyor height (mm) | 900±20 | |
| Conveyor direction | Left → right (standard) Right → left | |
| Conveyor drive mode | Stepping motor | |
| Power supply | Three phase 380V | |
| Rated power (kw) | 3.5 | |
| Industrial gas | Oxygen, nitrogen and argon | |
| Communication protocol | SMEMA | |
Time to release vacuum time (s) | ≤ 5 | |
| Conveyor mode | Belt conveyor + cylinder conveyor | |
Require Air pressure (Mpa) | 0.4-0.6 | |
| Display | 10 inch touch screen | |
Radio frequency power supply (w) | 0-500 (adjustable in range) | 0-1000 (adjustable in range) |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
