
The visual quality of alumina ceramic pad is vital at assemble process, Thus, deburr and polishing process will be manipulated before shipping, and then ensure the surface smooth free of any burrs.
Besides, alumina ceramic pad in the application could offer other strengths, such as wonderful electrical insulation high mechanical strength and corrosion resistance. The ceramic pad could significantly prolong the TO packaging service lifespan.
We have been producing various of standard alumina ceramic pads for MOS TO packaging, refer to the following table in detail:
S/N | Figure | Type | Size |
1 | ![]() | For TO-220 | 20mm *14mm * 1mm with φ5mm hole |
2 | For TO-220 | 18.5mm * 12mm * 1mm with φ3.8mm hole | |
3 | For TO-247 | 22mm * 17mm * 1mm with φ3.7mm hole | |
4 | For TO-264 | 28mm * 22mm * 1mm with 3.4mm hole | |
5 | For TO-3P | 25mm * 20mm * 1mm with φ4mm hole |
Remark: 0.6mm thick alumina ceramic pads are standard parts.
These alumina ceramic pads are widely used in MOS/IC/triode, diode & IGBT, high frequency communication devices, high density switching power supply, and high frenquency welding machines, and so on.
We have integrated production lines from raw material formulating, shaping, sintering and secondary process at house, hence, we could control the consistency of quality and manufacturing cost well.
If you are looking for ceramic pads for your Mosfet TO package, please feel free to call us or email to us. We'll be there anytime.