Shenzhen Jingxin Electronic Technology Co., Ltd. is a professional enterprise dedicated to PCB and PCBA manufacturing for 20 years, providing professional OEM electronic manufacturing services for customers in various fields worldwide. Since its establishment in 2002, the company has accumulated a group of engineers with more than ten years of manufacturing experience and a professional electronic components purchasing team. With ten years of professional spirit, providing professional engineering services (PCB layout design, SMT process technology solutions, etc.)
More than 1500 customers have witnessed our growth over the past 20 years, the company is located in building 13 and 17 Shenzhen. We have 10000 square meters of dust-free workshop and more than 800 employees, more than 30 production lines including PCB manufacturing, SMT, DIP, automatic welding, aging test, assembly, etc. The equipment includes over 50 SMT machines from Japan and Korea, an automatic solder paste printing machine, an automatic stencil test machine, an automatic stencil cleaning machine, an automatic first sample test machine, an SPI solder paste online detector, 12 temperature reflow soldering machine, on-line AOI detector, X-ray detector, lead-free wave soldering machine, automatic DIP machine, automatic PCB splitting machine, laser carving machine, automatic coating machine, automatic X-ray counting machine, intelligent MES electronic material management system, etc., with a daily output of 40 million points. A variety of production line configurations can meet all kinds of demands from sample orders (lead time 24 hours) to mass production delivery.
We have obtained ISO9001, ISO14001 and IATF16949 series of system certification
Specification: | ||||
PCB layers: | 1-24layers | |||
PCB materials: | CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free | |||
PCB max. board size: | 620*1100mm | |||
PCB certificate: | RoHS Directive-Compliant | |||
PCB Thickness: | 1.6 ±0.1mm | |||
Out Layer Copper Thickness: | 0.5-5oz | |||
Inner Layer Copper Thickness: | 0.5-4oz | |||
PCB max. board thickness: | 6.0mm | |||
Minimum Hole Size: | 0.20mm | |||
Minimum Line Width/Space: | 3/3mil | |||
Min. S/M Pitch: | 0.1mm(4mil) | |||
Plate Thickness and Aperture Ratio : | 30:1 | |||
Minimum Hole Copper: | 20µm | |||
Hole Dia. Tolerance(PTH): | ±0.075mm(3mil) | |||
Hole dia. Tolerance(NPTH): | ±0.05mm (2mil) | |||
Hole Position Deviation: | ±0.05mm (2mil) | |||
Outline Tolerance: | ±0.05mm (2mil) | |||
PCB surface finished: | HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver | |||
PCB solder mask: | Black, white, yellow | |||
Legend: | White | |||
E-test: | 100% AOI, X-ray, Flying probe test. | |||
Outline: | Rout and Score/V-cut | |||
Inspection Standard: | IPC-A-610CCLASSII | |||
Certificates: | UL (E503048),ISO9001/ISO14001/IATF16949 | |||
Outgoing Reports: | Final Inspection, E-test, Solderability Test, Micro Section and More | |||
PCB Assembly OEM Service | ||||
Electronic Components Material Purchasing | ||||
Bare PCB Fabrication | ||||
Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service | ||||
PCB Assembly Service: SMT, BGA, DIP | ||||
PCBA test:AOI, In-Circuit Test (ICT), Functioal Test (FCT) | ||||
Conformal Coating Service | ||||
Prototyping and Mass Production |
PCBA ODM service | ||||
PCB Layout, PCBA Design According To Your Idea | ||||
PCBA Copy/Clone | ||||
Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design | ||||
Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming | ||||
Embedded User Interface Design / lSystem Hardware Design |
