MoCu
Electronics, Industrial, Medical, Chemical, Heat Sink
ASTM
as Required
Alloy
Molybdenum Plate
Not Powder
Mo60cu40, Mo70cu30, Mo80cu20
Ground Polished
as Required
Professional
ISO9001:2000
Tongchang
Wooden Boxes
(0.1-20)*W*L
China
8101999000
Product Description
MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Surface: Plating Ni, NiAu, NiAg, or Non-plating
Product Properties:
Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Surface: Plating Ni, NiAu, NiAg, or Non-plating
Product Properties:
| Material | Wt% Molybdenum Content | Wt% Copper Content | g/cm3 Density at 20ºC | Thermal conductivity at 25ºC | Coefficient of thermal expansion at 20ºC |
| Mo85Cu15 | 85± 1 | Balance | 10 | 160 - 180 | 6.8 |
| Mo80Cu20 | 80 ± 1 | Balance | 9.9 | 170 - 190 | 7.7 |
| Mo70Cu30 | 70 ± 1 | Balance | 9.8 | 180 - 200 | 9.1 |
| Mo60Cu40 | 60 ± 1 | Balance | 9.66 | 210 - 250 | 10.3 |
| Mo50Cu50 | 50 ±0.2 | Balance | 9.54 | 230 - 270 | 11.5 |
Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
