Customized
Refractory, Structure Ceramic, Industrial Ceramic, Brazing
Alumina Ceramic
Ceramic Substrates for RF Application
96%, 99% and 99.5% Alumina
White, Beige, Pink
Polished, Glazed
1% of Dimensions
for Ceramic to Metal Joint Technology
Ceramic Parts
JingHui
Vacuum Packaging with Desciant
36cm x 20cm x 24cm
China
8547100000
Product Description
Metallized Ceramic Substrates for RF Radio Frequency Applications
Direct Plated Copper (DPC) technology is a ceramic circuit processing technology developed on the basis of ceramic thin film processing. Differentfrom the traditional thick film and thin film processing technology, its processing strengthens the requirements of electrochemical processing. After the metallization of the ceramic surface is achieved by physical methods, the conductive copper and functional film layers are processed electrochemically.
Under the trend of intelligence, the application of DPC technology will be more common to meet the needs of miniaturization and high precision.
Jinghui's mature DPC technology can customize the thickness of metal circuits for you to meet your diverse needs.
