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IC Leadframe Transfer Tooling for Sop8图1IC Leadframe Transfer Tooling for Sop8图2IC Leadframe Transfer Tooling for Sop8图3IC Leadframe Transfer Tooling for Sop8图4IC Leadframe Transfer Tooling for Sop8图5

IC Leadframe Transfer Tooling for Sop8

Price $25840.00
Min Order 1 Piece  
Shipping from Guangdong, China
Quantity
-+
Product details
SOP8-12R
1 Years Except Worn Parts
Hardware
Hard Alloy and Steel Bonded Carbide
Punching and Shearing Mould
Forming Die
Progressive Die
Automation Technology
Hybrid
EDM Milling
High Speed
Measurement of Three Axis NC
1 Years Except Worn Parts
Tjin
Box
Customerized
China
8486402900
Product Description

Leadframe is a base material for the package of most of package ICs.In order to provide high volume of mass productions,most of the customer prefer to enlarge the Leadframe dimensions.We could advise our solution to ensure the quality and the quantity requirement,to find a balance and then bring a totally lowest cost for customer to ensure their competitive device.

 

Features

1.Material: imported raw materials, all from first-tier brands;

2.Precision: tolerance value up to ± 0.001mm;

3.Technology: advanced equipment, strict standardization, top talent;

4.Finish: wire cutting with original Japanese sodick gf program electrode wire, to ensure good surface finish.

 

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Guangdong Taijin Semiconductor Technology Co., Ltd

Audited Supplier1 Year
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