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High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing图1High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing图2High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing图3High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing图4High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing图5High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing图6

High Precision Efficient Grinding Abrasive Ceramic Discs for Semiconductor Manufacturing

Price $1115.79
Min Order 5 Pieces  
Shipping from Zhejiang, China
Quantity
-+
Product details
Aerospace, Electronics, Home Use, Refractory
Ceramic Plate
Ceramic Grinding Disc
Yes
30 - 45 Days
100% Inspection
CERAMETA SEMICERA
Ningbo
Product Description
Product Description
Ceramic Grinding Disc
Precision Craftsmanship, Achieving Perfection in Grinding
        Core Advantages
  • High-Efficiency Grinding: Utilizes premium alumina abrasives with high hardness and exceptional wear resistance, significantly enhancing grinding efficiency.
  • Long-Lasting Durability: Treated with specialized processes, the disc features a compact structure and extended service life, reducing operational costs.
  • Wide Applicability: Suitable for rough grinding, fine grinding, and polishing of various metal and non-metal materials.
  • Stable and Reliable Performance: Resistant to clogging during grinding, ensuring consistent and stable grinding results.
      Application Scenarios
  • The wafer ceramic grinding disc is a critical process equipment used in semiconductor manufacturing, primarily for flattening and polishing hard materials such as silicon wafers.
      Technical Highlights
  • Unique Formulation: Optimized abrasive ratio to improve grinding efficiency and surface finish.
  • Advanced Manufacturing Process: High-temperature sintering technology enhances the strength and wear resistance of the grinding disc.
  • Precision Machining: Strict control over dimensional accuracy and dynamic balance ensures smooth and stable grinding operations.
Notes: Regular product samples charge a sample fee, and special ones charge a development fee (specifically based on the drawings and quantity).
Product Parameters
Ceramic PlatesRegulationUnit Price
abrasive diskΦ485*16mm$414.86 
abrasive diskΦ230*12mm$551.54 
abrasive diskΦ360*15mm$687.00 
abrasive diskΦ520*20mm$687.00 
abrasive diskΦ546*15mm$414.86 
Ceramic plateΦ127*5.1mm$109.92 
Ceramic plateΦ110*5mm$109.92 
abrasive diskΦ576*20mm$687.00 
Turntable307*Φ302*15mm$274.40 
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Sinotec Cerameta (Ningbo) Advanced Materials Technology Co., LTD

Audited Supplier1 Year
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