Aluminum base
Single-Sided Rigid PCB
Rcc
Aluminum Base
Consumer Electronics
V0
Electrolytic Foil
Additive Process
Aluminum
Rcc
Hjh
0.6-2.0mm
15um, 18um, 25um, 35um, 70um, Others
Green
0.6~2.0W
1060 / 5052
>130 Degree
AC>/=5kv
HJH
Pallet
1000*1200MM, 500*600MM, others
China
7410211000
Product Description
Aluminum Copper Clad Laminate Sheet
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052
Main Technical Characteristics
This kind of copper clad laminate is made of copper clad and aluminium plate by special adhesive under heating pressure.
Properties
High mechanical strength and dimensional stability,
Excellent heating radiating,
Good electric magnetic shield,
Easy machinery cutting
Applications
Widely used in the thick-film hybrid integrated circuits, LED module, LED backlight TV, LED lighting, high power electronics, IC chip substrates, automobile, motorcycle, electric car appliance, audio, solid state reply solid state voltage regulator module and etc.
Specifications
AL base materials: 1060, 5052
Sheet Thickness: 0.6~2.0mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm
Copper thickness: 15um, 18um, 25um, 35um, 70um, others
Usual size: 1000x1200mm, 500mm x 600mm, 500mm x 1200mm, 600mm x 1000mm
Thermal conductivity: 0.6W/m.K, 0.8W/m.K, 1.0W/m.K, 1.5W/m.K, 2.0W/m.K
Protective film: blue film (80ºC), green film (160ºC)
Main Technical Characteristics
| Items | Unit | Test condition | Typical values | ||
| AF-01 | AF-04 | AF-05 | |||
| Peel strength | N/mm | At normal: A | 2.00 | 1.05 | 1.08 |
| After thermal stress | 1.80 | 1.05 | 1.05 | ||
| Surface resistance | MΩ | At normal | 5.0 x 107 | 5.0 x 107 | 3.6 x 107 |
| Constant humidity treatment | 2.0 x 106 | 4.5 x 106 | 3.3 x 106 | ||
| Volume resistance | MΩ·m | At normal | 4.0 x 108 | 1.0 x 108 | 4.2 x 108 |
| Constant humidity treatment | 5.0 x 107 | 1.9 x 107 | 3.1 x 107 | ||
| Thermal resistance | ºC/w | At normal | 1.0 | 0.65 | 0.45 |
| Dielectric Constant @ 1 MHz | -- | 40ºC, 93%, 96h | 4.2 | 4.2 | 4.2 |
| Dielectric dissipation factor @1 MHz | -- | 40ºC, 93%, 96h | 0.02 | 0.029 | 0.033 |
| Thermal stress | min | 260ºC | 2 min, no delamination, no air bulb | ||
| Dielectric breakdown | KV/MM | At normal | 31 | 31 | 60 |
| Flammability | -- | At normal | FV-0 | ||
| Thermal-conductive factor | W/m·k | At normal | 1.0 | 1.5 | 2.2 |
