Single Sided PCB-2
Single-Layer
RoHS, CCC, ISO
Customized
OSP,Immersion Gold,Hal Lead Free,Hal
Green,Red,Yellow,White,Black,Blue,etc
Air,Sea,Express(DHL TNT FedEx EMS UPS)
3-5days
ZAPON
Vacuum Packing
UL, TS16949, IPC 600 CLASS 2
China
85340090
Product Description
ZHEJIANG ZAPON ELECTRONIC TECHNOLOGY Co., Ltd is a professional manufacture of PCB and PCBA. Which have the factory of single side PCB, double side PCB, multi-layer PCB and PCB assembly etc. We have the ability of produce for any medium and mass quantity. The machine of our factory are on work all day and all night. With Zapon as a supplier, you will have the highest quality, quickest delivery.
The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
The products:
Single-side PCB: CEM-1, FR-2, FR-1 XPC-94HB
Double-side PCB: FR-4, CEM-3, High Tg, Aluminum, Halogen Free
Multi-layer PCB: 4 to 22 layers(FR-4, High Tg, Rogers)
Certification: UL, ISO9001, ISO/TS16949: 2002, IS014001 and RoHS
THE CAPACITY OF PRODUCTION: 50, 000SQM. /month
| Item | Capabilities | ||
| Number of Layers | Single side | ||
| Material | CEM-1,FR-2,FR-1,FR-4,XPC-94HB | ||
| PCB Thickness | Min.thickness | 0.8mm(32mil) | |
| Max.thickness | 1.6mm(63mil) | ||
Surface finished | Flux | ||
| Nickel Plating | |||
| Gold Plating | |||
| Hot Air Solder Leveling(HASL) | |||
| Entek Coating (OSP) | |||
| Solder Mask | Green,White,Black,Yellow,Red,Blue | ||
| Other printing | Silver through hole | ||
| Carbon Print, Peelable Mask | |||
| Carbon Through Hole | |||
| Copper thickness | 1/2 oZ(18 um) - 1 oZ (35 um) | ||
| Min. Hole Size | CNC-Drilled | 0.4mm (16 mil) | |
| Punched | 0.8mm (32 mil) | ||
| Hole Size Tolerance (CNC Drilled) | +/ -0.076mm (3 mil) | ||
| Hole Size Tolerance (Punched) | +/ -0.1mm (4 mil) | ||
| Min. Line Width and Spacing | 0.2mm (8 mil) | ||
| Min. Solder Mask Clearance (UV Cure) | 0.15mm (6 mil) | ||
| Min. Solder Mask Clearance (Thermal Cure) | 0.1mm (4 mil) | ||
| Min. Annular Ring | 0.15mm (6mil) | ||
| Profile and V-Cut | Stamping, V-Cut and Beveling,CNC | ||
