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Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool图1Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool图2Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool图3Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool图4Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool图5Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool图6

Diamond Multi-Wire Saw Cutting Machine for Sapphire Ceramics Processing Tool

Price $200000.00
Min Order 1 set  
Shipping from Shandong, China
Quantity
-+
Product details
CA4040
on-Site Installation, Commissioning and Training
12 Months After Acceptance
New
CE, ISO 9001: 2015
Automatic
Alloy, Sapphire, Quartz Crystal, Silicon, Magnets
400X250X400mm
1000m/Min
Provide Test Cut Service
3000X2200X2820mm
5000kg
LiKai
Wooden Case
China
8464109000
Product Description

Product Description


CA4040 Multi-wire Saw

 

CA4040 Multi-wire Saw is mainly used for batch opening square of super hard and brittle materials such as Sapphire, Special Ceramics, Silicon Nitride, etc. into straight sheets. The machine can achieve cutting of super hard and brittle materials through workpiece swing to reduce cutting area. Five rollers design enables the machine to cut products within range of 5-60mm thickness.

 

Product Features

 

>Double Workstation
The machine adopts double-station design and is able to cut two plates materials at the same time.
>Easy Operation
Roller cutting system, workbench, tension system, take-up and pay-off and wire winding system are set in a plane for easy operation.
>Swing Cutting
The cutting force is stronger with the worktable swing design. Double worktable has an independent servo control system and can run independently.
>Flexible Wire Winding Mode
The rollers quantity can be flexibly changed between 3 and 5 to achieve cutting for products in different sizes.
>Stable Running
Five-roller direct drive structure leads to stable operation of the equipment.
>Wire Break Memory System

 

 

 

Cut Samples

 

 

Product Parameters

DetailParameter
ModelCA4040
Maximum work size400x250x400mm
Slice thickness5-60mm(wire winding number ≤50)
Workbench qty2
Roller out diameter *Workable width(φ180±10mm)*260mm*5
Wire diameterφ0.20mm-φ0.37mm
Wire Spool Storage40km(φ0.25mm)
Maximum running speed1000m/min
Travel of workbench lifting422mm
Workbench swing±7.5°
Cutting methodVertically upward movement
Cutting feed speed0.1-99.9mm/min
Cutting fluidWater--based cutting fluid or cutting Oil
Fluid storage800L
Fluid flow rate200L/min
Power SupplyThree-phase 380V 50Hz
Rated power42kw
Air supply≥ 0.4MPa.
SizeL*W*H3000mm*2200mm*2820mm
Weight5000Kg

About Us

FAQ

1. What Materials Could The Multi-Wire Saws Cut?
    Our multi-wire saws can cut all kinds of hard and brittle materials such as Sapphire, Quartz Crystal, Optical Glass, Magnets, Ceramics, Silicon Wafers, Silicon Carbide, Precious Metal, etc.
2. 
What's The Size Range Of The Cut Product?
    The maximum diameter of the cut material is up to 1000mm.
    The minimum thickness of the wafers after cutting is 0.1mm.
3. What's The Cut Accuracy Of Multi-Wire Saws?
   
±10μm. It's subject to the cut material, please consult us for actual data.
4. 
Which Countries The Equipments Have Been Exported To?
    The USA, UK, Russia, Japan, Brazil, Korea, India, Singapore, Taiwan of CHINA.

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Yantai Likai Numerical Control Technology Co., Ltd.

Audited Supplier1 Year
ProfileCertified by SGS/BV

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