| Item | Mass Producation | Small Batch Producation |
| Rigid Layer Counts | 1-36 | 38-64 |
| Flex Layer Counts | 2-6 | 8-10 |
| Rigid Flex Layer Counts | 4 - 14 | 16 - 20 |
| Standard Features | ||
| Max. board size (mm) | 580*620 | 1200*600 |
| Min. board size(mm) | 10*10 | 5*10 |
| Board thickness (mm) | 0.2~8mm | 0.2~8mm |
| Min. Line width/space (mil) | 3/3mil | 2.5/2.5mil |
| Outer Layer copper thickness (OZ) | 0.5 OZ-7OZ | 15 OZ |
| Inner layer copper thickness | 1OZ-7OZ | 12 OZ |
| Solder Mask color | Green, Blue, white, Black, Red, Yellow and so on | |
| Carbon Ink Thickness(mil) | 0.3mil | 0.3mil |
| Impedance control tolerance | <=+/-10% | <=8+/-% |
| Min. SM bridge for green soldermask(MM) | 0.1 | 0.076 |
| Min. SM bridge for black soldermask(MM) | 0.125 | 0.1 |
| Tolerance of dimension size (MM) | <=+/-0.13 | +/-0.1 |
| Tolerance of board thickness (MM) | >=1.0 +/-10% | +/- 8% |
| < 1.0 +/-0.1 | +/- 8% | |
| Tolerance of finished NPTH hole size(MM) | +/-0.05 | +/-0.05 |
| Tolerance of finished PTH hole size(MM) | +/-0.076 | +/-0.05 |
| Non-Conductive Via Fill (VIP) | Y | Y |
| Backdrilling | Y | Y |
| Hybrids & Mixed Dielectrics | Y | Y |
| HDI Features | ||
| Minimum Microvia Hole Size | 100μm [0.004"] | 75μm [0.003"] |
| Capture Pad Size | 0.25mm [0.010"] | 0.20mm [0.008"] |
| Maximum Aspect Ratio | 0.7:1 | 1:1 |
| Copper Filled Microvias | Y | Y |
| Stacked Microvias | Y | Y |
| Maximum No. of Buildup Layers | 3+N+3 | 5+N+5 |
| Bare PCB | |||||
| Layers | Quotation | Samples | 1-10 m² | 10-50 m² | ≥50 m² |
| 2 | 12H | 5days | 7days | 10days | 13days |
| 4 | 12H | 7days | 8days | 12days | 15days |
| 6 | 12H | 8days | 10days | 13days | 16days |
| 8 | 12H | 9days | 12days | 15days | 18days |
| 10 | 12H | 10days | 13days | 18days | 20days |
| ... | ... | ... | ... | ... | ... |
| PCB Assembly | ||
Order Conditions | Standard Delivery Date | The Fastest Delivery Date |
Prototype (<20 PCS) | 2-3 days | 12 hours |
Small Volume (20-100 PCS) | 4-5 days | 24 hours |
Medium Volume (100-1000 PCS) | 6-8 days | 36 hours |
Mass Production (>1000 PCS) | Depends on BOM | Depends on BOM |
√ 7*24 hours order service............
√ 7*24 hours delivery.....................
√ 7*24 hours production run..........
√ 7*24 hours technical support......
√ 2 hours of complaint feedback...
All the right materials for your next project.
RoHS Compliant
Turn to USUN Circuit to manufacture RoHS-compliant PCBs. We typically use SYST,Nanya ,Rogers products, as well as other options right for your project.
Materials include:
| FR4 Standard Tg | Shengyi, ITEQ, KB, Nanya | |
| FR4 Mid Tg (Lead Free Compatible) | Shengyi S1000, ITEQ IT158 | |
| FR4 High Tg(Lead Free Compatible) | Shengyi S1000-2, S1170,Isola 370HR,ITEQ IT180A, Panasonic R1755V | |
| High Performance Low Loss FR4 | Isola FR408HR,Panasonic R5775 Megtron 6,ITEQ IT968,TUC TU-872 SLK | |
| RF Materials | Rogers RO4350B, RO4003C ,RO3006 | |
| Halogen Free | TU-883 , IT-988G SE | |
| Rigid PI | Arlon 85N , Ventec VT-901 | |
| Flexible Circuit Materials | Dupont, Panasonic, Taiflex, Shengyi | |
| Hybrid laminating | Rogers/Taconic/Arlon/Nelco laminate with FR-4 material (including partial Ro4350B hybrid laminating with FR-4) | |
| Thermal Clad (including Aluminum Bonding) | ||
Finishes include:
- Immersion Tin (Sn)
- Immersion Sliver (Ag)
- Immersion Gold (Au)
- ENTEK/OSP (Organic Solder Preservative)
- Leaded
- Leadfree HAL
- Soft bondable gold
- High Tg/High performance FR-4 material
- Halogen-free solder mask
- Lead-free surface finishes
Contact Us for more information......
USUN has a professional team that provides a flexible one-stop solution for your PCBA project, including PCB design, component procurement, PCBA assembly, Box construction, and functional testing.
> 0-64 Layers Rigid PCB
> Metal core board
> HDI board
> RF board
> PCB Assembly
> Quick to respond Flexible Price with 24 hours
> Capacity of production: 100,000 m2 /Monthly;
> Capacity orders & Ship out: 10,000~15,000 part numbers/Monthly;
> Product Application Area:Car, Industrial Control, Power supply & Communication fields.
> System certification: ISO9001,ISO14001,IATF16949,ISO13485,QC080000,ISO9001,UL CERT
USUN employs current state-of-the-art circuit board production equipment, brings together experienced professionals for management, and introduces the latest technologies to ensure reliable and fast product delivery to customers.
1. How does FPC control the thickness of plated copper and hole copper?
Answer:Generally, the thickness ratio of plated copper and hole copper is 1:1.5, such as plated copper 6-8um, hole copper will reach 10-15um; Local copper plating is not acceptable.
2. What are the base material? What's the difference between Pl and PET materials?
Answer:
Materials: Polyimide (PI) and Polyester (PET)
Temperature resistance is different, Pl operating temperature can reach 130 degrees Celsius, the highest can withstand 250 degrees Celsius; PET operating temperature is only 50 degrees Celsius, the highest can withstand 105 degrees; FPC's common material is PI.
3. What are the common thicknesses of cover layer?
Answer:The cover layer includes adhesive, like 50um cover layer (25um Pl+25um adhesive), 27.5um cover layer (12.5um Pl+15um adhesive)
4. What are the common surface treatments of FPC?
Answer: ENIG, Gold plating, OSP, Immersion silver, ENEPIG (can't do HASL)
5. What are the types of FPC stiffener?
Answer:
Pl stiffener, thickness selection:
0.075mm, 0.1mm, 0.125mm, 0.15mm ,0.175mm, 0.2mm,0.225mm, 0.25mm.
FR4 stiffener, thickness selection:
0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm~1.6mm
Stainless steel stiffener, thickness selection: 0.1mm, 0.2mm
Aluminum stiffener, thickness selection:1.0mm, 2.0mm (Special, rarely used)
