IO32
Adjust
Combination
Linear
Continuous
Automatic Control
RoHS, CCC
New
Customized
Plastic
KAIDOO
Box
I/O32
China
84779000
Product Description
I/O 32 INPUT AND OUTPUT CIRCUIT BOARD IS SUITABLE TO AUTOMATIC BLOW MOULDING MACHINE ;
The working principle of the circuit board is to use the board-based insulation material to isolate the open surface copper foil conductive layer, so that the current flows along the pre-designed route in various components to complete functions such as work, amplification, attenuation, modulation, demodulation, coding and so on. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors Waterfer circuit board thin film line SMT chip Waterver circuit board thin film line SMT patch, filling, electrical boundary, etc., the main functions of each component are as follows:
Pad: A metal hole used to solder component pins.
Vias: There are metal vias and non-metallic vias, where metal vias are used to connect component pins between layers.
Mounting hole: Used to secure the board.
Wires: An electrical network copper film used to connect component pins.
Connector: A component used to connect between boards.
Filling: Copper coating for ground networks can effectively reduce impedance.
Electrical boundary: Used to determine the size of the board, which cannot be exceeded by all components on the board.
The working principle of the circuit board is to use the board-based insulation material to isolate the open surface copper foil conductive layer, so that the current flows along the pre-designed route in various components to complete functions such as work, amplification, attenuation, modulation, demodulation, coding and so on. The circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors Waterfer circuit board thin film line SMT chip Waterver circuit board thin film line SMT patch, filling, electrical boundary, etc., the main functions of each component are as follows:
Pad: A metal hole used to solder component pins.
Vias: There are metal vias and non-metallic vias, where metal vias are used to connect component pins between layers.
Mounting hole: Used to secure the board.
Wires: An electrical network copper film used to connect component pins.
Connector: A component used to connect between boards.
Filling: Copper coating for ground networks can effectively reduce impedance.
Electrical boundary: Used to determine the size of the board, which cannot be exceeded by all components on the board.
