Silicon wafer wheel
Thinning
Diamond Abrasive
Silicon Wafer Back
Polishing
80#---1000#
Cylindrical
1 Years
7 Days/24 Hours
Long Life
Cubic Boron Carbide
OEM, ODM
Vitrified & Resin
Diamond Grinding Wheel
Wooden Box
Angle Grinding Wheels
Vitrified & Resin
Steel or Aluminium
HT
Wooden Boxes
JB
Henan, China
Product Description
Silicon Wafer Back Grinding Wheels
Application areas and scope of application:
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
It is mainly used for thinning and fine grinding of semiconductor wafers
Features:
1. Excellent grinding performance and high cost performance.
2. lt can be stably used in grinding machines made in Europe, America, Japan and China, and can replace imported products.
Product name | Silicon Wafer Back grinding wheel | OEM | Supported |
Advantage | Good performance | Size | Customized |
Bond | Diamond | Grit size | Customized |
OED | Supported | Package | Woonden box & cartoon box |
