Product Description
| Item | Manufacturing Capability |
| Material | CEM-1, CEM-3, FR-4(Normal to high Tg), Halogen-free, High CTI, PolyImide(Flex), Metal Base, etc. |
| Layer Count | Rigid: 1-16L; Flex: 1-8L; Rigid-flex: 2-6L |
| Thinnest Laminate | 0.13mm(excluding Cu thickness) |
| Board Thickness | Rigid: 0.25-6.0mm |
| Copper Thickness | Max 6oz |
| Surface Finish | HAL, ENIG,Immersion Silver/Tin, OSP, Flash Gold, Plated Hard Gold(Gold Finger) |
| Board Size | Max 1200mm*520mm |
| Min Trace W/S | 3/3mil |
| Min Finished Hole Size | 0.1mm(Laser Drill); 0.2mm(Mechanical Drill) |
| Hole Size Tolerance | PTH:+/-0.075mm; NPTH:+/-0.05mm |
| Aspect Ratio | Max 12:1 |
| Layer Misregistration | ≤3mil |
| Outline Tolerance | +/-0.1mm |
| Impedance Control Tolerance | +/-10% |
| Peelable Soldermask Thickness | ≥0.2mm |
