Features:
1) A variety of specifications available.
2) Satisfy various technical request
3) Lower medium spoilage
4) Good insulation performance and high temperature resistance
5) Stiffness texture
6) Low thermal conductivity
7) Used in all electric products and electric heating products
Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.
Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm
Data Sheet :
| Material | 85 Al2o3 | 90 Al2o3 | 95 Al2o3 | 99 Al2o3 |
| Al2o3 | 85% | 90% | 93% | 99.30% |
| Fe2o3 | ≤ 1.0 | ≤ 0.5 | ≤ 0.5 | ≤ 0.3 |
| Desnsity: g / cm3 | 3.4 | 3.5 | 3.6 | 3.85 |
| Vickers Hardness | ≥ 8.6 | ≥ 8.8 | 9 | 9 |
| Water Absorption:% | ≤ 0.2 | ≤ 0.1 | ≤ 0.085 | ≤ 0.01 |
| Refractoriness:°C | 1580 °C | 1600 °C | 1650 °C | 1800°C |
| Flexural Strength:Mpa | 180 | 200 | 240 | 280 |
Wear Rate( at room temperature, erosion, 100 grinding)% | ≤ 3 | ≤ 2.5 | ≤ 1 | ≤ 0.5 |
| Test Items | Technical Parameters | Test Conditions |
| Printing layer/Coating graphic | Keep in conformity with the product drawing | 10 x microscope |
| Printing layer/Coating thickness | Keep in conformity with the product drawing | X ray fluorescence thickness gauge |
| Drying-out resistance | No defects on printing layer/ coating surface such as blisters, discolor, peeling | Heating on heating board 300ºC/5min |
| Solder invasive | Invasive area≥95% | 260±5ºC/5±1 Sec immersion tin |
| Soldering resistance | Unilateral adhered tin 75μm | 260±5ºC/10±1 Sec immersion tin |
| Tension | Printing layer >20gf | Welding plate crossed φ130μm Cu |
| Adhesion | Not stripping | Tape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec |
2:Application:
1.The Plate Is Mainly Used In High-Density Hybrid Circuits,Microwave Power
Devices, Power Semiconductor Devices,Power Electronic Devices,
Optoelectronic Components,Semiconductor Refrigeration Products Such As
Substrates For High-Performance Materials And Packaging Materials
